7 бер. 2013  Düsseldorf / Germany

Effective Deposition and Traceability Capability

Encapsulants for Sensitive Components

Formulated to address the drawbacks of alternative products, Henkel Electronic Materials announces the commercial availability of two encapsulants for selective protection of environmentally-susceptible components. The materials, Loctite Eccobond UV9060F and Loctite Eccobond EN 3707F, deliver an impermeable barrier to potential environmental influences and offer manufacturers cure process flexibility and deposition traceability.

Both materials provide tough protection against the destructive effects of environmental contaminants like moisture and fluids such as beverages and perspiration.  Designed for high-UPH production environments, both Loctite Eccobond UV9060F and Loctite Eccobond EN 3707F cure quickly with UV light in less than 30 seconds and contain a subsequent cure mechanism to ensure shadowed areas not exposed to UV light are fully cured Loctite Eccobond UV9060F has a secondary moisture cure and a secondary thermal cure is built into Loctite Eccobond EN 3707F.

Dr. Brian Toleno, Director of Global Product Management for Underfills and Encapsulants at Henkel, explains the significance of the materials’ selective application capability. “These materials are ideal for devices such as connectors, memory slots and components close to charger or headset connection ports,” says Dr. Toleno.  “If a manufacturer doesn’t want to conformal coat or pot the entire assembly, these materials enable targeted material deposition which means lower costs and often better protection.  Conformal coatings are effective over large areas, but do have a tendency to wick, produce opens and not cover corners or odd shapes well.  These innovative encapsulants solve those issues.”

Fluorescent tracer for visual inspection

In addition to their fast cure advantage and excellent protection, Loctite Eccobond UV9060F and Loctite Eccobond EN 3707F also have unique processability and traceability characteristics.  Both materials can be applied via non-contact dispensing or traditional needle dispensing to accommodate varying manufacturing requirements and high-UPH processes. A major innovation is the fluorescent tracer designed into each encapsulant. Because protective materials are often opaque, visually inspecting them is difficult.  With Loctite Eccobond UV9060F and Loctite Eccobond EN 3707F, exposure to black light illuminates the materials’ fluorescent tracers and allows operators to verify the intended coverage areas.

“The ability to selectively apply, quickly cure and visually inspect are arguably significant advances in protective encapsulant technology,” notes Toleno in summary.  “These materials are perfect for any application with components or connectors that are susceptible to adverse environmental factors.”

For more information about Loctite Eccobond UV9060F and Loctite Eccobond EN 3707F, visit our website www.henkel.com/electronics.